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Ceramic Cover Ring / Liner

1. Product OverviewThe Ceramic Cover Ring / Liner is a high-performance, specialized component

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Product Description

1. Product Overview

The Ceramic Cover Ring / Liner is a high-performance, specialized component designed for semiconductor manufacturing equipment. It is a consumable-critical part that directly interfaces with the wafer during plasma-based processes, serving a vital role in process protection, yield enhancement, and equipment longevity.

2. Core Function & Purpose

The cover ring is engineered to surround and protect the wafer’s edge and perimeter during processing. Its primary functions include:

  • Protecting Critical Chamber Components: By covering the wafer’s edge, it shields sensitive chamber parts from direct exposure to plasma, corrosive gases, and process byproducts.
  • Extending Equipment Service Life: It acts as a sacrificial barrier, taking the brunt of plasma erosion and deposition buildup, thereby reducing wear on more expensive chamber hardware.
  • Ensuring Process Uniformity & Wafer Yield: It helps regulate plasma distribution and gas flow around the wafer edge, which is critical for achieving consistent etch/deposition results and maximizing final wafer yield.

3. Key Performance Characteristics

Given its direct exposure to harsh deposition and plasma environments, the ceramic cover ring offers these essential features:

  • High Plasma Durability: Resists long-term erosion and degradation caused by high-energy plasma, minimizing particle generation and contamination risk.
  • High Purity Material: Manufactured from high-grade ceramic materials, ensuring minimal contamination that could otherwise compromise semiconductor processes.
  • Process Compatibility: Designed to perform reliably in the aggressive chemical and thermal conditions of etching, deposition, and other plasma-based semiconductor processes.

4. Product Specifications & Customization

  • Wafer Size Compatibility: Available in configurations tailored for 12-inch, 8-inch, and 6-inch semiconductor equipment, covering mainstream wafer processing requirements.
  • Surface Coating Option: Offered with an optional ARC (Anti-Reflective Coating) aluminum-sprayed surface, which can enhance performance characteristics such as plasma reflectivity or thermal management for specific process needs.

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