Etch Parts

1. Product Overview

Etch Parts are high-precision semiconductor-grade consumables and structural components specially designed for wafer etching process systems. Manufactured from high-purity alumina ceramic, fused quartz and anti-corrosion inorganic materials, these parts cover full series of core accessories for dry etching, wet etching and plasma etching equipment. They ensure ultra-clean chamber environment, stable plasma status and consistent process accuracy, acting as essential components for high-precision wafer patterning and mass production yield control.

2. Core Function & Application

• Etch Parts mainly undertake plasma shielding, electric field insulation, gas flow uniform distribution and wafer edge protection during semiconductor etching processes. They effectively constrain high-energy plasma, isolate stray discharge, optimize internal chamber flow field, and achieve precise material removal and uniform circuit pattern definition on wafer surfaces.
• The product series includes ceramic shadow rings, focus rings, insulator rings, ceramic nozzles, chamber cover domes, shielding plates and other core etching consumables, widely applied in oxide etching, metal etching, silicon etching and deep reactive ion etching (DRIE) processes.
• These components stabilize plasma uniformity, reduce particle generation, resist chemical corrosion and plasma sputtering, minimize wafer edge defects, and maintain long-term consistency of etching rate and surface uniformity for mass semiconductor manufacturing.

3. Key Performance Requirements & Advantages

Working continuously under extreme conditions of high vacuum, high temperature, strong electric field and halogen corrosive gas, Etch Parts meet strict semiconductor manufacturing standards:

• Excellent Plasma Sputtering Resistance: Adopts high-density pure ceramic and quartz materials to resist long-term plasma bombardment and fluorine/chlorine-based gas erosion, avoiding surface peeling, particle contamination and component deformation.
• Ultra-High Purity & Low Defect: Zero metal precipitation formula with ultra-low impurity content, effectively preventing wafer metal pollution and micro-defects, improving process stability and product yield.
• Superior Insulation & Dimensional Stability: Low thermal expansion coefficient and excellent dielectric properties ensure no structural deformation under frequent thermal cycles, maintaining precise assembly tolerance and stable plasma distribution.

4. Product Variants

A complete range of standardized and customized Etch Parts covers full specifications for mainstream semiconductor etching equipment:

• Plasma shielding & chamber protection components including ceramic dome covers, shadow shields and insulating baffles.
• Plasma tuning components such as focus rings and insulator rings for edge uniformity optimization.
• High-precision functional parts including etching gas nozzles, flow splitters and customized structural parts for advanced etching process tools.