Diffusion / RTP Parts

1. Product Overview

Diffusion / RTP Parts are high-temperature resistant, high-purity critical components designed for semiconductor thermal process equipment. Specially engineered for high-temperature diffusion furnaces and Rapid Thermal Processing (RTP) systems, these precision parts are manufactured from premium ceramic and quartz materials. They provide stable structural support, uniform thermal environment and ultra-clean chamber conditions, ensuring high consistency and repeatability for wafer annealing, oxidation, doping and thermal curing processes.

2. Core Function & Application

• The primary role of Diffusion / RTP Parts is to stabilize high-temperature thermal fields, support wafer loading and positioning.
• They serve as core structural and consumable components for diffusion furnaces and RTP tools, supporting key processes including wafer oxidation, nitridation, doping diffusion, rapid thermal annealing and thin-film stabilization.
• They maintain consistent wafer spacing, optimize thermal radiation uniformity, and prevent particle contamination and thermal deformation, ensuring excellent in-wafer and wafer-to-wafer process uniformity.

3. Key Performance Requirements & Advantages

Since Diffusion / RTP Parts operate continuously under ultra-high temperature environments, frequent thermal cycling and inert process gas atmospheres, they meet stringent semiconductor thermal process standards:

• Extreme High-Temperature Stability: Featuring ultra-low thermal expansion coefficient and excellent thermal shock resistance, the parts resist deformation, cracking and structural fatigue under long-term high-temperature and rapid temperature rise/fall conditions.
• Ultra-High Purity & Low Particle Generation: Adopting high-purity ceramic and quartz materials, they minimize impurity precipitation and particle shedding, effectively avoiding wafer contamination and improving production yield.
• Superior Chemical Inertness: Maintains stable chemical performance in high-temperature oxygen, nitrogen and inert gas environments, resisting oxidation and gas corrosion to ensure long-term process stability.

4. Product Variants

The product line covers a full range of specifications to adapt to different furnace structures and RTP equipment models:

• Wafer carrier components including wafer boats, trays and support pins for high-temperature diffusion furnace systems.
• Thermal insulation covers, guard rings and shielding parts for RTP rapid thermal process temperature field optimization.
• Custom high-precision structural parts with exclusive dimensions and tolerance requirements for advanced thermal process equipment.