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Exhaust Shroud / Others

1. Product OverviewExhaust Shroud and other auxiliary chamber parts are high-purity, high-durab

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Product Description

1. Product Overview

Exhaust Shroud and other auxiliary chamber parts are high-purity, high-durability structural components designed for semiconductor etching, deposition and thermal process equipment. Manufactured from premium ceramic, quartz and corrosion-resistant engineering materials, these components serve as essential peripheral accessories for process chambers. They optimize internal gas flow circulation, isolate residual pollutants, and protect core equipment structures, ensuring clean, stable and efficient operation of semiconductor process systems.

2. Core Function & Application

  • The primary role of Exhaust Shroud and matched auxiliary parts is to guide uniform exhaust of residual process gases, stabilize internal chamber airflow field, and block stray particles and plasma interference during wafer processing. These components maintain balanced chamber pressure and clean process surroundings to guarantee consistent wafer machining quality.
  • They act as critical gas guiding and protective components for plasma etching, PVD/CVD deposition and thermal processing equipment, effectively exhausting redundant reactive gases and reaction by-products.
  • They prevent turbulent airflow and particle backflow inside the chamber, shield key equipment components from corrosion and sputtering damage, and improve overall process stability and equipment operation safety.

3. Key Performance Requirements & Advantages

Since Exhaust Shroud and auxiliary parts are continuously exposed to corrosive residual gases, fluctuating pressure and trace plasma radiation in confined chamber environments, they meet rigorous semiconductor industrial performance standards:

  • Superior Chemical Corrosion Resistance: Stably resists erosion of fluorine-based, chlorine-based and other corrosive residual process gases, avoiding surface aging, peeling and structural damage during long-term cyclic production.
  • Ultra-Low Particle Generation & High Purity: Adopts high-purity raw materials with dense surface texture, effectively reducing shedding and impurity precipitation to avoid wafer contamination and improve production yield.
  • Excellent Structural & Dimensional Stability: Features reliable pressure resistance and low thermal deformation, maintaining precise fitting tolerance and stable airflow guiding performance under long-term fluctuating temperature and pressure conditions.

4. Product Variants

The product line includes various structural specifications and customized accessories to adapt to different semiconductor equipment models and process layouts:

  • Standard exhaust shroud components for conventional chamber gas guiding and exhaust optimization.
  • Customized airflow shielding covers and protective auxiliary parts for special process chamber structures.
  • Matching chamber auxiliary structural parts with exclusive sizes and tolerance standards for advanced semiconductor processing tools.

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