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Focurhead Electrodes Ring / Showe

1. Product OverviewFocushead Electrode and Shower Parts are high-precision, semiconductor-grade

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Product Description

1. Product Overview

Focushead Electrode and Shower Parts are high-precision, semiconductor-grade core components dedicated to wafer plasma process equipment. Fabricated from high-purity, high-insulation ceramic and specialized conductive materials, these precision parts are key assembly components of equipment focus head systems. They are designed to stabilize electric field distribution and achieve uniform process gas delivery, providing ultra-clean, consistent and reliable process conditions for etching and deposition fabrication.

2. Core Function & Application

  • The primary role of Focushead Electrode and Shower components is to generate uniform plasma electric fields and achieve laminar flow distribution of process gases inside the process chamber. They coordinate to stabilize plasma intensity, eliminate process dead zones, and ensure consistent reaction conditions for wafer surface processing.
  • Focushead Electrodes are responsible for bearing and transmitting RF electric fields, forming stable and uniform plasma excitation environment, which is the core guarantee for precise plasma etching and thin-film deposition processes.
  • Focushead Showers adopt precision orifice design to evenly disperse corrosive and reactive process gases, avoid gas turbulence and local concentration deviation, and improve the uniformity of wafer processing across the entire surface.

3. Key Performance Requirements & Advantages

Since these parts operate in high-energy plasma environments, high-frequency electric fields and corrosive process gas atmospheres for a long time, they comply with strict semiconductor process performance standards:

  • Excellent Electrical Stability: Possess superior dielectric strength and stable conductive performance, resist high-frequency electric field impact and electrical breakdown, and maintain long-term consistent plasma excitation effects.
  • Superior Plasma and Chemical Resistance: Effectively withstand plasma sputtering and erosion of fluorine-based and chlorine-based corrosive gases, avoid surface degradation and particle generation, and reduce process contamination risks.
  • High Dimensional and Structural Stability: Precision integral forming ensures uniform orifice distribution and electrode flatness, with low thermal deformation, maintaining ultra-high process repeatability in continuous mass production.

4. Product Variants

The product line includes multiple specifications and customized models to match different process equipment and technical requirements:

  • Standard Focushead Electrodes with stable conductivity for conventional plasma etching and deposition equipment.
  • Precision Focushead Shower components with diversified hole layouts and flow rates for uniform gas delivery requirements.
  • Integrated focus head assembly parts and custom structural parts with exclusive sizes for special semiconductor process tools.

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