EPI Parts

1. Product Overview

Etch Parts are high-precision, semiconductor-grade critical components specially engineered for wafer etching process equipment. Covering a full range of core consumables and structural accessories for dry etching and wet etching systems, these parts are manufactured from high-purity ceramic, quartz and corrosion-resistant materials. They maintain ultra-clean chamber conditions and precise process parameters, serving as indispensable components for stable and high-yield semiconductor wafer etching fabrication.

2. Core Function & Application

• The primary role of Etch Parts is to support stable plasma reaction, uniform gas distribution, effective wafer protection and precise process control during semiconductor etching procedures. They isolate, guide and stabilize process gases and high-energy plasma, ensuring accurate circuit patterning and material removal on wafer surfaces.
• They act as key structural and consumable components for etching equipment, including insulator rings, focus rings, shield parts, gas nozzles and chamber protective components, applicable to DRIE, oxide etching, metal etching and other plasma etching processes.
• They stabilize plasma uniformity, block stray particles, protect wafer edges and chamber structures, and effectively reduce process defects to ensure consistent etching rate and excellent wafer surface uniformity.

3. Key Performance Requirements & Advantages

Since Etch Parts work in long-term high-energy plasma bombardment, strong corrosive process gas and high-vacuum rigorous environments, they comply with strict semiconductor process performance standards:

• Superior Plasma & Chemical Resistance: Resists continuous plasma sputtering and erosion from fluorine-based, chlorine-based corrosive gases, avoiding structural damage and performance degradation during long-cycle etching production.
• Ultra-Low Defect & High Purity: Adopts ultra-high-purity raw materials with stable chemical properties, effectively preventing metal ion precipitation and particle pollution, greatly improving wafer yield and process repeatability.
• Excellent Insulation & Dimensional Stability: Features reliable dielectric performance and low thermal expansion, maintaining structural integrity and precise fitting tolerance under high-temperature and high-electric-field process conditions to stabilize plasma distribution.

4. Product Variants

The product line includes diverse specifications and functional types to match different etching equipment models and process requirements:

• Etch shield & cover parts for chamber protection and particle isolation.
• Focus rings & insulator rings for plasma optimization and wafer edge process calibration.
• Custom precision etch structural parts with exclusive sizes and tolerance standards for specific advanced etching process tools.